The best solution for small volume prototypes

Multi-layer chip


From 440€ for 15mmX75mm customized glass chip*

• Price fixe for a 4" unit wafer

• No extra charge if mask is provided (.dxf)​


• 10% warrantly on depth homogeneity


• Fast reply within 24 hours**

*Device fabricated on Boro materials top cover 1mm/ bottom cover 1mm. Max thickness 100µm; lateral entries - Min 4 chips ordering - Chromium mask fabrication not included. 

** Opening working days

Fabrication process flow

Our manufacturing process flow and characterization use conventional top-down technologies equipements and is realized in an ISO6 cleanroom. It is composed of 3 mains steps:


  • Photolithography: Features transferring from a photomask to the glass substrate containing Cr/Au and an UV photoresist layer. The hard mask removing is performed by a RIE step.   


  • Chemical wet etching: The opened structures are plunged in a hydrofluoric acid bath. This etching is isotropic, leading to flattened channel sections. 


  • Bonding: Low thermal bonding < 300°C by Klearia’s patented process.

Potential of glass microchips

Mainly microfluidics technologies used polymer based materials (elastomers, thermoplastics) for the low entry cost and the fast protoyping capabilities. However, glass remain the best material for extreme conditions experiments with a higher chemical and bulge pressure resistances capabilities than conventional polymers.  It is also perfectly polyvalent for various kind of applications requiring optics, cell culturing, or surface grafting.    

Chemical resistance 

(HNO3, H2SO4~1mol/L)

Optical benefits

(DUV/UV, VIS and IR)

Pressure resistance 


Sensors/transductors compatible 


Graffting capabilities


Bacteriological control

(No-cytotoxic, Autoclaving)

Lab-On-Chip - Sensors chips

Thanks to our low thermal bonding solution and to our experience in lift-off micro-fabrication processes, we developed a perfect control of electrodes embedding and deport for external connections.


Various materials until 10 microns spatial resolution can be embedded on the same chip!


Electrochemical chips


Lower temperature - Higher performance

Standard fusion bonding 

Embedded technology

Electrode delamination - no organics

Klearia’s patented low thermal bonding glass process at temperature <300°C  improved the quality of materials embedment in microfluidic channels conducting to high performance sensors and transductors.

Catalogue of materials

Choice of electrode materials is fundamental for end-users needs. We anticipate trends and propose on the catalogue the best choice for recurrent applications like electrochemical sensing, cell sorting, dielectrophoresis,….

• The standards

• The "organics" 

• On request



Connect to the world a microfuidic chips or a LoC device is not obvious for non experts. Based on our experience in electrochemical analysers integration (PandA),  we propose an ergonomic and polyvalent holder solution.

The ConnectIn’Glass

• Suitable for standard microscope stages

• Adaptable dimensions up to 75x75mm


• Up to 8 inputs to 8 outputs


• Commercial fittings

The e-CIG bloc (option)

• Up to 8 electrodes integration

• Standard “banana” jack


Rue Bernard Gregory